Integrating dynamic fab capacity and automation models for 300 mm semiconductor manufacturing

Semiconductor fabrication facilities (fabs) continue to expand in both complexity and volume. As a result, integrated models are required to determine even high level impacts to key success indicators. In order to gain insight into how the components of a factory impact performance metrics, Intel uses an integrated discrete event simulation modeling approach. Two models, one fab capacity and one automation model, are used. This paper discusses the methodology for building and integrating both models, and the results from using this method. Both the fab capacity and automation models have a variety of input parameters that are required to drive the simulation. In addition, each model produces output parameters, some of which are used as inputs to the other model. An iterative feedback technique eventually results in a convergence on the appropriate data to feed the fab capacity model, which enables Intel to determine the impact of automation on 300 mm wafer semiconductor manufacturing, and predict factory performance. Intel´s approach provides the capability to use the models in stand-alone mode for specific fab-only or automation-only analyses, and also to take on any number of analyses via model communication. Intel continues to search for new applications for these merged models to answer strategic operational questions