• DocumentCode
    2826379
  • Title

    Polystyrene-Silver composites for embedded capacitor applications

  • Author

    Thomas, Dhanesh ; Sreelakshmi, K.P. ; Manu, K.M. ; Sebastian, M.T.

  • Author_Institution
    Mater. Div., Nat. Inst. for Interdiscipl. Sci. & Technol., Trivandrum, India
  • fYear
    2011
  • fDate
    18-22 Dec. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The present paper reports the preparation and characterization of Polystyrene-Silver composites for embedded capacitor applications. The composites have been prepared by ultrasonic mixing followed by hot pressing. The percolation threshold is found to be decreasing from 0.1 Vf for silver of particle size <; 250 μm to 0.07 Vf for nano silver. The composites have temperature stable relative permittivity.
  • Keywords
    capacitors; filled polymers; hot pressing; particle size; permittivity; permittivity measurement; polymers; silver; Ag; embedded capacitor application; hot pressing; nanosilver; particle size; percolation threshold; permittivity; polystyrene-silver composite; ultrasonic mixing; Capacitors; Conductivity; Permittivity; Polymers; Powders; Silver; Embedded capacitor; conductivity; dielectric; nano-composite; percolation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Electromagnetics Conference (AEMC), 2011 IEEE
  • Conference_Location
    Kolkata
  • Print_ISBN
    978-1-4577-1098-8
  • Type

    conf

  • DOI
    10.1109/AEMC.2011.6256861
  • Filename
    6256861
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2826379