• DocumentCode
    2826394
  • Title

    Effect of amorphous fillers on low loss ceramics for advanced microwave electronics

  • Author

    Varghese, Jobin ; Gopinath, Sumesh ; Sebastian, M.T.

  • Author_Institution
    Mater. Div., Nat. Inst. for Interdiscipl. Sci. & Technol., Thiruvananthapuram, India
  • fYear
    2011
  • fDate
    18-22 Dec. 2011
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper we report the development of a low-temperature sinterable Cu2ZnNb2O8 (CZN) based composite for low-temperature cofired ceramic (LTCC). The CZN ceramics were prepared by the solid-state ceramic route. The calcination and sintering temperatures of CZN were optimized at 800°C and 975°C, respectively, for the best density and dielectric properties. The microwave dielectric properties of ceramic were measured by split post dielectric resonator (SPDR). The CZN sintered at 975°C had εr = 15.2, tanδ = 0.0009 at 5.1 GHz. The sintering temperature of CZN is lowered from 975°C to 915°C by the addition of both LBS and LMZBS glasses. CZN mixed with 0.7 wt% LBS and sintered at 915°C had εr = 14.8, tanδ = 0.001 at 5.1 GHz. The addition of 0.7 wt% LMZBS to CZN and sintered at 935°C/4 h had εr = 14.6, tanδ = 0.002 at 5.1 GHz.
  • Keywords
    calcination; ceramics; dielectric properties; filler metals; sintering; CZN ceramics; Cu2ZnNb2O8; advanced microwave electronics; amorphous fillers; calcination; frequency 5.1 GHz; low loss ceramics; low temperature cofired ceramic; low temperature sinterable; microwave dielectric property; sintering temperatures; solid-state ceramic route; split post dielectric resonator; temperature 800 C; temperature 915 C; temperature 975 C; Ceramics; Dielectric losses; Glass; Permittivity; Temperature; Temperature measurement; LTCC; microwave dielectrics; sintering temperature; substrates;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Applied Electromagnetics Conference (AEMC), 2011 IEEE
  • Conference_Location
    Kolkata
  • Print_ISBN
    978-1-4577-1098-8
  • Type

    conf

  • DOI
    10.1109/AEMC.2011.6256862
  • Filename
    6256862