• DocumentCode
    2827892
  • Title

    Screening attenuation of differential cable-connector assemblies

  • Author

    Hekkala, Aki ; Tarvainen, Timo

  • Author_Institution
    Esju Oy, Oulu, Finland
  • fYear
    2004
  • fDate
    9-12 May 2004
  • Firstpage
    175
  • Lastpage
    178
  • Abstract
    High speed data transmission is now required in many applications. One limiting factor on speed can be radiated emissions. This paper presents simulation and measurement results on electromagnetic leakage of various differential cable connector assemblies. Leakage modelling aspects are also considered. Differential and common mode interferences as well as single and double shielded assemblies where grounding pin number directly connected to the cable screen varies are studied. The research methods are FIT simulations and absorbing clamp measurements. It is shown that the symmetry of the differential shielding is important and to suppress common mode interferences high amount of grounding pins is required when unscreened connectors like typical high-speed digital ones are used. Double shielded assemblies leak much less.
  • Keywords
    cable shielding; electric connectors; electromagnetic interference; FIT simulations; absorbing clamp measurements; cable screen; common mode interference; differential cable connector assemblies; differential cable-connector assemblies; differential interference; differential shielding; double shielded assemblies; electromagnetic leakage; grounding pin number; high speed data transmission; leakage modelling; radiated emissions; screening attenuation; single shielded assemblies; Assembly; Attenuation; Cable shielding; Connectors; Data communication; Electromagnetic measurements; Electromagnetic radiation; Electromagnetic radiative interference; Electromagnetic shielding; Grounding;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Signal Propagation on Interconnects, 2004. Proceedings. 8th IEEE Workshop on
  • Print_ISBN
    0-7803-8470-9
  • Type

    conf

  • DOI
    10.1109/SPI.2004.1409044
  • Filename
    1409044