Title :
Modeling of 3D packages using EM simulators
Author :
Kelander, Ilkka ; Arslan, Ali Nadir ; Hyvönen, Lassi ; Kangasmaa, Seppo
Author_Institution :
Nokia Corp., Helsinki, Finland
Abstract :
This paper discusses the modeling of 3D electronic packages. A 3D model of a stacked die package solution is built and analyzed in a 3D electromagnetic (EM) simulation tool, and a lumped element RLC equivalent model is extracted. The challenges and possibilities of EM simulation are discussed. The parasitic components of the package are studied by analyzing the 3D model by parts. Strategies in specifying a Spice net list of the package model and its feasibility in circuit simulations are considered.
Keywords :
circuit simulation; equivalent circuits; integrated circuit modelling; integrated circuit packaging; lumped parameter networks; 3D electromagnetic simulation tool; 3D electronic packages; 3D package modeling; EM simulators; Spice net list; circuit simulations; lumped element RLC equivalent model; parasitic components; stacked die package solution; Analytical models; Circuit simulation; Computational modeling; Computer simulation; Electromagnetic analysis; Electromagnetic modeling; Electronics packaging; Equivalent circuits; Mathematical model; RLC circuits;
Conference_Titel :
Signal Propagation on Interconnects, 2004. Proceedings. 8th IEEE Workshop on
Print_ISBN :
0-7803-8470-9
DOI :
10.1109/SPI.2004.1409046
