Title :
Characterization of via holes on printed circuit boards
Author :
Antonini, G. ; Lai, M. ; Orlandi, A. ; Ricchiuti, V.
Author_Institution :
Dept. of Electr. Eng., L´´Aquila Univ., Italy
Abstract :
When high speed digital signals propagate on printed circuit boards (PCBs), all the on board discontinuities are a concern for the electronic designers. Among them, the via holes, allowing the signals to jump from an external PCB layer to an internal one, are of paramount importance. The paper compares the transmission performances of three different kind of single ended and differential vias (through, blind and buried), providing the better solution for propagating high speed digital signals on a multi-layer PCB.
Keywords :
printed circuits; blind vias; board discontinuities; buried vias; differential vias; high speed digital signals; multilayer PCB; printed circuit boards; single ended vias; through vias; via holes; Bandwidth; Consumer electronics; Costs; Integrated circuit packaging; Knowledge based systems; Modems; Pins; Printed circuits; Scattering parameters; Signal design;
Conference_Titel :
Signal Propagation on Interconnects, 2004. Proceedings. 8th IEEE Workshop on
Print_ISBN :
0-7803-8470-9
DOI :
10.1109/SPI.2004.1409055
