DocumentCode
2829012
Title
Comparison of graphene nanoribbons with Cu and Al interconnects
Author
Wang, Ning ; English, Chris D. ; Pop, Eric
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Illinois at Urbana-Champaign, Urbana, IL, USA
fYear
2012
fDate
18-20 June 2012
Firstpage
123
Lastpage
124
Abstract
We present a comparative study of graphene nanoribbon (GNR) interconnects (ICs) with sub-50 nm copper (Cu) and aluminum (AI) ICs. We extend existing models for all materials in order to understand the physical size effects that occur when the electron mean free path (AMFP) becomes comparable to the IC dimensions. We calibrate such models against the best publicly available data. We find that, depending on geometrical configuration, either Al or GNRs could hold advantages over Cu at linewidths <;10 nm.
Keywords
aluminium; copper; graphene; interconnections; nanoribbons; AMFP; Al; C; Cu; GNR interconnects; IC dimensions; aluminum interconnects; electron mean free path; geometrical configuration; graphene nanoribbons; physical size effects; Aluminum; Copper;
fLanguage
English
Publisher
ieee
Conference_Titel
Device Research Conference (DRC), 2012 70th Annual
Conference_Location
University Park, TX
ISSN
1548-3770
Print_ISBN
978-1-4673-1163-2
Type
conf
DOI
10.1109/DRC.2012.6256995
Filename
6256995
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