• DocumentCode
    2830863
  • Title

    Features of conduction mechanism in n-type Mg2Si1-xSnx solid solutions

  • Author

    Fedorov, M.I. ; Pshenay-Severin, D.A. ; Zaitsev, V.K. ; Sano, S. ; Vedernikov, M.V.

  • Author_Institution
    A.F. Ioffe Phys. Tech. Inst., St. Petersburg, Russia
  • fYear
    2003
  • fDate
    17-21 Aug. 2003
  • Firstpage
    142
  • Lastpage
    145
  • Abstract
    N-type Mg2Si1-xSnx solid solutions are known as efficient thermoelectrics for middle temperature range. High figure of merit of this material could be explained by the features of its band structure. The compounds Mg2Si and Mg2Sn have two close conduction bands giving a contribution into transport properties. In the Mg2Si1-xSnx solid solutions a convergence of these bands takes place and it is necessary to take into account interband scattering. The analysis of temperature dependencies of kinetic coefficients was made, where scattering on impurities, acoustical interband and intraband scattering were taken into account. The contribution of interband scattering into Seebeck and Hall coefficients and electrical conductivity is estimated for the solid solutions of various composition and various current carrier concentration.
  • Keywords
    Hall effect; Seebeck effect; band structure; carrier density; energy gap; magnesium compounds; silicon compounds; thermoelectricity; tin compounds; Hall coefficients; Mg2Si1-xSnx; Seebeck coefficients; acoustical interband scattering; acoustical intraband scattering; conduction bands; conduction mechanism; electrical conductivity; high figure of merit; interband scattering; kinetic coefficients; n-type Mg2Si1-xSnx solid solutions; transport properties; Acoustic scattering; Conducting materials; Conductivity; Impurities; Kinetic theory; Solids; Temperature dependence; Temperature distribution; Thermoelectricity; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2003 Twenty-Second International Conference on - ICT
  • Print_ISBN
    0-7803-8301-X
  • Type

    conf

  • DOI
    10.1109/ICT.2003.1287469
  • Filename
    1287469