DocumentCode
2831028
Title
Advantageous power factor anomaly in Mn1.68-XCu0.6+X+Y+ZCo0.24-YNi0.48-zO4 thin films
Author
Moyer, Jerome G. ; Kukuruznyak, Dmitry A. ; Prowse, Michael S. ; Ohuchi, Fumio S.
Author_Institution
Dept. of Mater. Sci. & Eng., Univ. of Washington, Seattle, WA, USA
fYear
2003
fDate
17-21 Aug. 2003
Firstpage
180
Lastpage
183
Abstract
Thermopower and electrical conductivity are measured on compositional variations of a reference composition, Mn1.68-XCu.6+X+Y+ZCo.24-YNi.48$ -ZO4, and the changes in the power factor terms are examined. Thin films obtained through Metal Organic Decomposition, MOD, are used for the compositional profiling. MOD is a low-temperature fabrication route allowing for the retention of meta-stable Mn4+ and Cu1+ ions essential to these n-type materials´ properties. Conduction occurs via polaron hopping between those Mn having different oxidation states. Compositional variations modify the oxidation states of Mn and Cu, and in turn, the conductivity and thermopower values. The data indicates that replacing portions of Co with Cu raises both the conductivity and thermopower magnitude, and exchanging small amounts of Ni with Cu reduces these thermoelectric, TE, factors. Surprisingly, the effects of doping show parallel rises or declines in conductivity and thermopower magnitude.
Keywords
MOCVD coatings; cobalt compounds; copper compounds; electrical conductivity; hopping conduction; manganese compounds; nickel compounds; semiconductor thin films; thermoelectric power; Mn1.68-XCu0.6+X+Y+ZCo0.24-YNi0.48-ZO4; Mn1.68-XCu0.6+X+Y+ZCo0.24-YNi0.48-ZO4 thin films; compositional profiling; compositional variations; electrical conductivity; low-temperature fabrication route; metal organic decomposition; oxidation states; polaron hopping; power factor anomaly; thermopower; Conducting materials; Conductivity measurement; Electric variables measurement; Fabrication; Oxidation; Power measurement; Reactive power; Tellurium; Thermoelectricity; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 2003 Twenty-Second International Conference on - ICT
Print_ISBN
0-7803-8301-X
Type
conf
DOI
10.1109/ICT.2003.1287478
Filename
1287478
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