• DocumentCode
    2831089
  • Title

    Plastic-package-type optoelectronic transmitter module using resinous sealing

  • Author

    Terashima, T.

  • Author_Institution
    Oki Electr. Ind. Co. Ltd., Tokyo, Japan
  • fYear
    1998
  • fDate
    22-27 Feb. 1998
  • Firstpage
    193
  • Lastpage
    194
  • Abstract
    Summary form only given. Summary form only given. The FTTH (fiber-to-the-home) optical access network for direct access between an office and users for mutual transmission of multimedia information through one optical fiber is predicted. For the implementation of FTTH, however, cost reduction on the ONU (optical network unit) to be installed at each subscriber is the most important task to be attained. Therefore, development of new optoelectronic technologies for cost reduction, downsizing and productivity improvement of optical modules is required. Because active alignment method to adjust the fiber position while driving the device has so far been the main technology for optical module assembly, there has been a certain limit in cost reduction because of the large number of components and required man-hours. From a reliability viewpoint, hermetically-sealed packages have been used to protect the devices from moisture and oxidation. However, the cost of a metallic or ceramic hermetically-sealed package is higher than non-hermetically-sealed packages. In this paper, we introduce component technologies making use of the passive alignment technique and report the optical characteristics of a plastic-package-type transmitter module using resinous sealing. This module, which consists of Si-V groove, LD (laser diode) and monitor PD (photodiode), is assembled using a passive-alignment technique. A 1.3 /spl mu/m LD, a single-mode fiber with a ferrule and a monitor PD are mounted on a Si substrate.
  • Keywords
    integrated optoelectronics; laser beam applications; modules; optical transmitters; plastic packaging; seals (stoppers); semiconductor lasers; 1.3 micron; FTTH optical access network; Si; Si substrate; Si-V groove; fiber-to-the-home; laser diode; monitor photodiode; optical characteristics; optoelectronic transmitter module; passive-alignment technique; plastic-package-type; resinous sealing; single-mode fibre; subscriber unit; Assembly; Costs; Monitoring; Optical devices; Optical fiber networks; Optical fiber subscriber loops; Optical fibers; Optical network units; Optical transmitters; Packaging;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical Fiber Communication Conference and Exhibit, 1998. OFC '98., Technical Digest
  • Conference_Location
    San Jose, CA, USA
  • Print_ISBN
    1-55752-521-8
  • Type

    conf

  • DOI
    10.1109/OFC.1998.657325
  • Filename
    657325