Title :
The optimization of thermoelectric parameters when introducing impurities with variable valence
Author :
Rogacheva, E.I. ; Nashchekina, O.N. ; Dresselhalis, M.S.
Author_Institution :
Kharkov Polytech. Inst., Ukraine
Abstract :
The thermoelectric properties (the electrical and thermal conductivity, the Seebeck and Hall coefficients) of SnTe-based solid solutions in the Sn-In-Te system along In and Te isoconcentrates (1-5 at.% In and 50.0-51 at.% Te) and along radial sections SnTe-InTe and SnTe-In2Te3 were studied in the temperature range 300-800 K. The ratio of In atoms in different charge states (In3+ and In1+) was controlled by changing the degree of deviation from stoichiometry at a fixed In concentration. It was established that the maximum value of the figure of merit ZT (∼1 at 800 K) can be attained through doping SnTe with In2Te3, which corresponds to the simultaneous introduction of indium in the In3+ charge state and cation vacancies. The experimental results were interpreted on the basis of a model for the energy spectrum of SnTe doped with In, taking into account the deviation from stoichiometry in SnTe and a variable valence of indium. It is shown that the introduction of impurities with a variable valence creates new opportunities for controlling the thermoelectric properties.
Keywords :
Fermi level; Hall effect; III-VI semiconductors; IV-VI semiconductors; Seebeck effect; band structure; indium compounds; stoichiometry; thermoelectricity; tin compounds; 300 to 800 K; Hall coefficients; Seebeck coefficients; SnTe-In2Te3; SnTe-InTe; cation vacancies; charge state; charge states; deviation from stoichiometry; electrical conductivity; figure of merit; impurities with variable valence; radial sections; thermal conductivity; thermoelectric parameters; Atomic measurements; Control systems; Impurities; Indium; Solids; Tellurium; Temperature control; Temperature distribution; Thermal conductivity; Thermoelectricity;
Conference_Titel :
Thermoelectrics, 2003 Twenty-Second International Conference on - ICT
Print_ISBN :
0-7803-8301-X
DOI :
10.1109/ICT.2003.1287499