DocumentCode :
2831605
Title :
Thermoelectric properties of intermetallic compounds: Mg3Bi2 and Mg3Sb2 for medium temperature range thermoelectric elements
Author :
Kajikawa, Takenobu ; Kimura, Naoyuki ; Yokoyama, Takahiro
Author_Institution :
Shonan Inst. of Technol., Kanagawa, Japan
fYear :
2003
fDate :
17-21 Aug. 2003
Firstpage :
305
Lastpage :
308
Abstract :
Hot-press sintered thermoelectric elements of intermetallic compounds: Mg3Bi2 and Mg3Sb2 were examined for the feasibility as medium temperature range thermoelectric elements, which belong to the family of zinc blend crystal structure. The experiments were carried out varying the sintering temperature in order to find out the optimum morphology for the sintered material system, because the thermoelectric performance was affected with the macro- and micro-structure due to the sintering, process. Seebeck coefficients (S), electrical conductivity (σ) and thermal conductivity (κ) were measured in the temperature range from 300K to 773K. According to the Seebeck coefficient measurement, both materials were p-type semiconductor. As the results, the power factor (=S2σ) could be obtained from 1.0x10-3 W/m2K at 550K to 2.5x10-3 W/m2K at 773K for Mg3Bi2 system and from 1.0x10-3 W/m2K at 600K to 2.0x 10-3 W/m2K at 740K for Mg3Sb2 system respectively. The measurement of thermal conductivity by laser flash method showed that the hot-press sintered Mg3Sb2 element had the relatively low thermal conductivity. The estimate for Mg3Sb2 elements promisingly shows the dimensionless figure of merit ZT of 0.55 at 660K.
Keywords :
Seebeck effect; crystal morphology; electrical conductivity; hot pressing; magnesium compounds; sintering; thermal conductivity; thermoelectric power; thermoelectricity; 300 to 773 K; 550 K; 600 K; Mg3Bi2; Mg3Sb2; Seebeck coefficients; dimensionless figure of merit; electrical conductivity; medium temperature range thermoelectric elements; optimum morphology; sintering temperature; thermal conductivity; thermoelectric performance; thermoelectric properties; zinc blend crystal structure; Bismuth; Conducting materials; Conductivity measurement; Intermetallic; Semiconductor materials; Temperature distribution; Temperature measurement; Thermal conductivity; Thermoelectricity; Zinc;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2003 Twenty-Second International Conference on - ICT
Print_ISBN :
0-7803-8301-X
Type :
conf
DOI :
10.1109/ICT.2003.1287510
Filename :
1287510
Link To Document :
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