• DocumentCode
    2831605
  • Title

    Thermoelectric properties of intermetallic compounds: Mg3Bi2 and Mg3Sb2 for medium temperature range thermoelectric elements

  • Author

    Kajikawa, Takenobu ; Kimura, Naoyuki ; Yokoyama, Takahiro

  • Author_Institution
    Shonan Inst. of Technol., Kanagawa, Japan
  • fYear
    2003
  • fDate
    17-21 Aug. 2003
  • Firstpage
    305
  • Lastpage
    308
  • Abstract
    Hot-press sintered thermoelectric elements of intermetallic compounds: Mg3Bi2 and Mg3Sb2 were examined for the feasibility as medium temperature range thermoelectric elements, which belong to the family of zinc blend crystal structure. The experiments were carried out varying the sintering temperature in order to find out the optimum morphology for the sintered material system, because the thermoelectric performance was affected with the macro- and micro-structure due to the sintering, process. Seebeck coefficients (S), electrical conductivity (σ) and thermal conductivity (κ) were measured in the temperature range from 300K to 773K. According to the Seebeck coefficient measurement, both materials were p-type semiconductor. As the results, the power factor (=S2σ) could be obtained from 1.0x10-3 W/m2K at 550K to 2.5x10-3 W/m2K at 773K for Mg3Bi2 system and from 1.0x10-3 W/m2K at 600K to 2.0x 10-3 W/m2K at 740K for Mg3Sb2 system respectively. The measurement of thermal conductivity by laser flash method showed that the hot-press sintered Mg3Sb2 element had the relatively low thermal conductivity. The estimate for Mg3Sb2 elements promisingly shows the dimensionless figure of merit ZT of 0.55 at 660K.
  • Keywords
    Seebeck effect; crystal morphology; electrical conductivity; hot pressing; magnesium compounds; sintering; thermal conductivity; thermoelectric power; thermoelectricity; 300 to 773 K; 550 K; 600 K; Mg3Bi2; Mg3Sb2; Seebeck coefficients; dimensionless figure of merit; electrical conductivity; medium temperature range thermoelectric elements; optimum morphology; sintering temperature; thermal conductivity; thermoelectric performance; thermoelectric properties; zinc blend crystal structure; Bismuth; Conducting materials; Conductivity measurement; Intermetallic; Semiconductor materials; Temperature distribution; Temperature measurement; Thermal conductivity; Thermoelectricity; Zinc;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2003 Twenty-Second International Conference on - ICT
  • Print_ISBN
    0-7803-8301-X
  • Type

    conf

  • DOI
    10.1109/ICT.2003.1287510
  • Filename
    1287510