DocumentCode :
2831916
Title :
Thermal and thermoelectric properties of III-nitride and III-oxynitride films
Author :
Izaki, R. ; Iwamura, Y. ; Yamaguchi, S. ; Yamamoto, A.
Author_Institution :
Dept. of Electr., Electron. & Inf. Eng., Kanagawa Univ., Yokohama, Japan
fYear :
2003
fDate :
17-21 Aug. 2003
Firstpage :
380
Lastpage :
383
Abstract :
With the aim of fabricating a thermoelectric power device using III-nitrides (Al1-xInxN, InN and AlN) and III-oxynitrides (Al1-xInxOyNz and InOyNz), we studied their thermal and thermoelectric properties and, in particular, we have focused on their thermal conductivity. Al1-xInxN and Al1-xInxOyNz were prepared by reactive radiofrequency sputtering method. We measured the thermal diffusivity and specific heat using the ac calorimetric method, and we estimated values of the thermal conductivity to be 1.5 W/mK (at 673 K) for Al1-xInxN and 0.8 W/mK (at 673 K) for Al1-xInxOyNz. These values are much smaller than expected considering the large thermal conductivity of nitrides.
Keywords :
III-V semiconductors; aluminium compounds; indium compounds; insulating thin films; semiconductor thin films; thermal conductivity; thermal diffusivity; thermoelectricity; wide band gap semiconductors; 673 K; Al1-xInxN; Al1-xInxOyNz; reactive radiofrequency sputtering method; specific heat; thermal conductivity; thermal diffusivity; thermal properties; thermoelectric properties; Choppers; Frequency; Gallium nitride; Gases; Photonic band gap; Semiconductor films; Tellurium; Temperature dependence; Thermal conductivity; Thermoelectricity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2003 Twenty-Second International Conference on - ICT
Print_ISBN :
0-7803-8301-X
Type :
conf
DOI :
10.1109/ICT.2003.1287527
Filename :
1287527
Link To Document :
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