• DocumentCode
    2832171
  • Title

    Fabrication of layered p-type AgSbTe2-(Bi,Sb)2Te3 thermoelectric module and its performances

  • Author

    Kubo, M. ; Itoh, T. ; Tokuda, K. ; Shan, J. ; Kitagawa, K.

  • Author_Institution
    Res. Center for Adv. Energy Conversion, Nagoya Univ., Japan
  • fYear
    2003
  • fDate
    17-21 Aug. 2003
  • Firstpage
    429
  • Lastpage
    432
  • Abstract
    A layered p-type thermoelectric module of AgSbTe2-(Bi,Sb)2Te3 was fabricated by a Spark Plasma Sintering (SPS) process and its´ performances was evaluated with both calculation and measurement. Each powder of AgSbTe2 and (Bi,Sb)2Te3 was consolidated by the SPS process. Various temperature distributions in the two-layered module were simulated by solving an unsteady one-dimensional equation of heat conduction based on the obtained data of thermoelectric properties. An optimum junction point of two elements was predicted from numerical changes in the performances with the connecting position of two materials. Several materials for the electrodes were tested to find better bonding condition between the thermoelectric material and the electrode. Finally, the performances of the resulting module were measured. It was found that the performances predicted by the calculation were in fairly good agreement with the measured ones.
  • Keywords
    antimony compounds; bismuth compounds; silver compounds; sintering; thermal conductivity; thermoelectric conversion; thermoelectricity; AgSbTe2-(BiSb)2Te3; bonding condition; layered p-type AgSbTe2-(Bi,Sb)2Te3 thermoelectric module; spark plasma sintering process; two-layered module; unsteady one-dimensional heat conduction equation; Conducting materials; Electrodes; Fabrication; Performance evaluation; Plasma measurements; Plasma simulation; Plasma temperature; Sparks; Tellurium; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2003 Twenty-Second International Conference on - ICT
  • Print_ISBN
    0-7803-8301-X
  • Type

    conf

  • DOI
    10.1109/ICT.2003.1287540
  • Filename
    1287540