DocumentCode :
2832645
Title :
Dynamic measurement system of thermoelectric module parameters
Author :
Mitrani, D. ; Tomé, J.A. ; Salazar, J. ; Turó, A. ; García, M.J. ; Chávez, J.A.
Author_Institution :
Electr. Eng. Dept., Univ. Politecnica de Catalunya, Barcelona, Spain
fYear :
2003
fDate :
17-21 Aug. 2003
Firstpage :
524
Lastpage :
527
Abstract :
A simple and easy-to-use device for measuring thermoelectric module (TEM) properties is presented. The characterization system provides continuous direct measurement of TEM hot and cold side temperatures, electric current flow, and terminal voltage. Seebeck voltage is measured using the Harman method. These measurements are then used to obtain dynamic values of TEM fundamental parameters: electrical resistance, thermal conductance and Seebeck coefficient, from which the TEM figure-of-merit can be calculated. Test conditions, i.e., current flowing through the module can be varied by the user. The thermal circuit used by the characterization system includes an auxiliary TEM that enables to emulate a controlled ambient temperature, which increments the repeatability and versatility of each test. Additionally, the dynamic response can be varied by interchanging the thermal load. Repeatability tests show a dispersion between direct measurements of less than 50mK for temperature measurements and less than 4mV for voltage measurements.
Keywords :
Seebeck effect; electrical resistivity; temperature measurement; thermal conductivity; thermoelectric devices; thermoelectricity; voltage measurement; Harman method; Seebeck coefficient; Seebeck voltage; cold side temperatures; dynamic measurement system; electric current flow; electrical resistance; figure-of-merit; hot side temperatures; terminal voltage; thermal conductance; thermoelectric module parameters; Circuit testing; Current measurement; Electric resistance; Electric variables measurement; Electrical resistance measurement; Fluid flow measurement; Temperature; Thermoelectric devices; Thermoelectricity; Voltage measurement;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2003 Twenty-Second International Conference on - ICT
Print_ISBN :
0-7803-8301-X
Type :
conf
DOI :
10.1109/ICT.2003.1287564
Filename :
1287564
Link To Document :
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