DocumentCode :
2832661
Title :
An automated microprobe for temperature dependent spatial scanning of the Seebeck coefficient
Author :
Platzek, D. ; Zuber, A. ; Stiewe, C. ; Bähr, G. ; Reinshaus, P. ; Müller, E.
Author_Institution :
Inst. of Mater. Res., German Aerosp. Center, Koln, Germany
fYear :
2003
fDate :
17-21 Aug. 2003
Firstpage :
528
Lastpage :
531
Abstract :
The common principle of scanning the Seebeck coefficient at the surface of a thermoelectric material is based on simultaneous measurement of two thermo-voltages, caused by a temperature gradient between a tip-shaped hot microprobe and the sample. A pointed probe mounted to a three dimensional micro-positioning system allows the determination of the individual thermopower of each single sample position. So far, this method has only been working at ambient temperature. Recent improvement of the measuring device by the implementation of a cooling/heating system led to an expansion of the sample temperature ranging between about 30 K below and above room temperature and enables computer controlled repeated scans on the sample surface at different stabilised temperatures set in user defined steps. In this way, along with the sample homogeneity, the temperature dependence of the Seebeck coefficient near room temperature can be determined at different locations of the sample, facilitating an advanced analysis of thermoelectric materials.
Keywords :
Seebeck effect; computerised instrumentation; microsensors; power factor measurement; 270 to 330 K; Seebeck coefficient; automated microprobe; computer controlled repeated scans; cooling/heating system; simultaneous measurement; temperature dependent spatial scanning; temperature gradient; thermoelectric material; three dimensional micro-positioning system; tip-shaped hot microprobe; two thermo-voltages; Aerospace materials; Control systems; Electric variables measurement; Heat sinks; Probes; Resistance heating; Temperature control; Temperature dependence; Temperature distribution; Thermoelectricity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2003 Twenty-Second International Conference on - ICT
Print_ISBN :
0-7803-8301-X
Type :
conf
DOI :
10.1109/ICT.2003.1287567
Filename :
1287567
Link To Document :
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