Full-chip reliability analysis

Author

Rochel, Steffen ; Steele, Gregory ; Lloyd, J.R. ; Hussain, Syed Zakir ; Overhauser, David

Author_Institution

Simplex Solutions Inc., Sunnyvale, CA, USA

fYear

1998

fDate

March 31 1998-April 2 1998

Firstpage

356

Lastpage

362

Abstract

Reliability analysis has not been promoted to the full-chip realm because techniques to extract, manage, and process full-chip power grid and signal data have not been previously available. This paper introduces techniques that have been developed to permit both full-chip power grid and signal net electromigration and Joule heating analysis. Results of this analysis provide feedback to the designer to permit easy design modification to provide superior "designed-in" long term reliability.

Keywords

electromigration; heating; integrated circuit design; integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; integrated circuit testing; data extraction; data processing; design modification; designed-in reliability; full-chip power grid analysis; full-chip power grid data; full-chip reliability analysis techniques; full-chip signal data; reliability analysis; signal net Joule heating analysis; signal net electromigration analysis; Circuits; Conductors; Current density; Data mining; Electromigration; Frequency; Heating; Performance analysis; Power grids; Wire;

fLanguage

English

Publisher

ieee

Conference_Titel

Reliability Physics Symposium Proceedings, 1998. 36th Annual. 1998 IEEE International

Conference_Location

Reno, NV, USA

Print_ISBN

0-7803-4400-6

Type

conf

DOI

10.1109/RELPHY.1998.670669

Filename

670669