DocumentCode :
2833248
Title :
A comparative study of leakage mechanism of Co and Ni salicide processes
Author :
Goto, Ken-Ichi ; Watanabe, Junichi ; Sukegawa, Takae ; Fushida, Atsuo ; Sakuma, Takashi ; Sugii, Toshihiro
Author_Institution :
Fujitsu Labs. Ltd., Atsugi, Japan
fYear :
1998
fDate :
March 31 1998-April 2 1998
Firstpage :
363
Lastpage :
369
Abstract :
We investigated the leakage mechanisms of both Co and Ni salicide processes. Statistical analyses of the junction leakage and a direct light observation of the leakage points from Co and Ni salicided junctions revealed that Ni salicide also shows many localized spots that cause leakage just like those in the Co salicide case, but in the Ni salicide case, the spots are along the LOCOS edge. Leakage currents were successfully simulated by means of a new spike-leakage model that considers both area and peripheral dependent spike leakage. To explain the subsequent results, we proposed a stress induced spike growth model. Working from this model, we developed a spike-leakage-free Co salicide process using a Ge pre-amorphization step.
Keywords :
annealing; cobalt; integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; integrated circuit testing; isolation technology; leakage currents; nickel; Co salicide; Co salicide process; Co salicided junctions; Ge pre-amorphization step; LOCOS edge leakage spots; Ni salicide; Ni salicide process; Ni salicided junctions; area dependent spike leakage; junction leakage; leakage currents; leakage mechanism; leakage points; localized leakage spots; peripheral dependent spike leakage; spike-leakage model; spike-leakage-free Co salicide process; statistical analysis; stress induced spike growth model; Annealing; Conductivity; Laboratories; Leakage current; Logic devices; Statistical analysis; Stress; Temperature; Tin; Wet etching;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Reliability Physics Symposium Proceedings, 1998. 36th Annual. 1998 IEEE International
Conference_Location :
Reno, NV, USA
Print_ISBN :
0-7803-4400-6
Type :
conf
DOI :
10.1109/RELPHY.1998.670670
Filename :
670670
Link To Document :
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