• DocumentCode
    2833248
  • Title

    A comparative study of leakage mechanism of Co and Ni salicide processes

  • Author

    Goto, Ken-Ichi ; Watanabe, Junichi ; Sukegawa, Takae ; Fushida, Atsuo ; Sakuma, Takashi ; Sugii, Toshihiro

  • Author_Institution
    Fujitsu Labs. Ltd., Atsugi, Japan
  • fYear
    1998
  • fDate
    March 31 1998-April 2 1998
  • Firstpage
    363
  • Lastpage
    369
  • Abstract
    We investigated the leakage mechanisms of both Co and Ni salicide processes. Statistical analyses of the junction leakage and a direct light observation of the leakage points from Co and Ni salicided junctions revealed that Ni salicide also shows many localized spots that cause leakage just like those in the Co salicide case, but in the Ni salicide case, the spots are along the LOCOS edge. Leakage currents were successfully simulated by means of a new spike-leakage model that considers both area and peripheral dependent spike leakage. To explain the subsequent results, we proposed a stress induced spike growth model. Working from this model, we developed a spike-leakage-free Co salicide process using a Ge pre-amorphization step.
  • Keywords
    annealing; cobalt; integrated circuit interconnections; integrated circuit metallisation; integrated circuit reliability; integrated circuit testing; isolation technology; leakage currents; nickel; Co salicide; Co salicide process; Co salicided junctions; Ge pre-amorphization step; LOCOS edge leakage spots; Ni salicide; Ni salicide process; Ni salicided junctions; area dependent spike leakage; junction leakage; leakage currents; leakage mechanism; leakage points; localized leakage spots; peripheral dependent spike leakage; spike-leakage model; spike-leakage-free Co salicide process; statistical analysis; stress induced spike growth model; Annealing; Conductivity; Laboratories; Leakage current; Logic devices; Statistical analysis; Stress; Temperature; Tin; Wet etching;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Reliability Physics Symposium Proceedings, 1998. 36th Annual. 1998 IEEE International
  • Conference_Location
    Reno, NV, USA
  • Print_ISBN
    0-7803-4400-6
  • Type

    conf

  • DOI
    10.1109/RELPHY.1998.670670
  • Filename
    670670