DocumentCode
2833273
Title
Nanocalorimetric devices with thermoelectric PECVD p-Si1-xGex thin film layers for the analysis of biological phase transitions
Author
Bottner, H. ; Jaegle, M. ; Künzel, Ch ; Benkendorf, M. ; Vetter, U. ; Auer, P. ; Lambrecht, A.
Author_Institution
Fraunhofer Inst. Physikalische Messtechnik, Freiburg, Germany
fYear
2003
fDate
17-21 Aug. 2003
Firstpage
669
Lastpage
672
Abstract
In order to realise thermoelectric devices for sensors, coolers, and energy conversion systems the technology of thin film thermoelectric materials has to be developed. We present our progress in the development and application of thin PECVD-films of the widely used Si1-xGex as a thermoelectric material. We report on the development and the properties of high quality boron doped p-Si1-xGex PECVD-layers with power factors up to 12 μW/cmK2. Using these layers a concept was developed and a technology of a MEMS related calorimetric device for biotechnological applications was realised. We report on the properties of first calorimeters. Calorimetric data will be given using the phase transition of DMPC-emulsions diluted in aqueous solution. DMPC (Dimyristoylphosphatidylchloline) is a phospholipid forming multilamelar vesicles or membrane bilayers in water.
Keywords
Ge-Si alloys; biosensors; boron; lipid bilayers; micromechanical devices; microsensors; plasma CVD coatings; semiconductor thin films; thermoelectricity; DMPC-emulsions; MEMS related calorimetric device; Si1-xGex:B; biological phase transitions; coolers; dimyristoylphosphatidylchloline; energy conversion systems; nanocalorimetric devices; phospholipid forming multilamelar vesicles; sensors; thermoelectric PECVD p-Si1-xGex:B thin film layers; Boron; Energy conversion; Nanoscale devices; Reactive power; Sensor systems; Thermal sensors; Thermoelectric devices; Thermoelectricity; Thin film devices; Thin film sensors;
fLanguage
English
Publisher
ieee
Conference_Titel
Thermoelectrics, 2003 Twenty-Second International Conference on - ICT
Print_ISBN
0-7803-8301-X
Type
conf
DOI
10.1109/ICT.2003.1287601
Filename
1287601
Link To Document