DocumentCode :
2833309
Title :
Micromachined thermoelectric test device based on silicon/germanium superlattices: Simulation, preparation and characterization of thermoelectric behavior
Author :
Schumann, J. ; Kleint, C.A. ; Vinzelberg, H. ; Thomas, J. ; Hecker, M. ; Nurnus, Joachim ; Boettner, H. ; Lambrecht, A. ; Künzel, C. ; Voelklein, F.
Author_Institution :
Leibniz-Inst. for Solid State & Mater. Res., Dresden, Germany
fYear :
2003
fDate :
17-21 Aug. 2003
Firstpage :
677
Lastpage :
681
Abstract :
Strain-symmetrized superlattice structures based on epitaxially grown Si/Ge multilayers are expected to be promising systems for efficient thermoelectric micro-systems. The paper presents the development of a membrane-type sensor device consisting of Si/Ge superlattice and SixGe1-x-alloy legs allowing the study of the thermoelectric behavior at minimized influence of the supporting substrate components. By means of numerical simulation the optimum layout parameters were determined as well as the temperature distribution within the device including the sensitivity to be expected were estimated. Black body radiation measurements of the functional parameters on nearly freestanding thermopile arrays in the sensor regime are presented.
Keywords :
elemental semiconductors; germanium; micromachining; microsensors; semiconductor superlattices; silicon; thermal conductivity; thermoelectric devices; thermoelectricity; Si-Ge; Si-Ge superlattices; SixGe1-x; SixGe1-x-alloy legs; membrane-type sensor device; micromachined thermoelectric test device; numerical simulation; optimum layout parameters; strain-symmetrized superlattice structures; temperature distribution; thermoelectric behavior; Germanium; Nonhomogeneous media; Sensor arrays; Sensor phenomena and characterization; Silicon; Superlattices; Testing; Thermal sensors; Thermoelectric devices; Thermoelectricity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermoelectrics, 2003 Twenty-Second International Conference on - ICT
Print_ISBN :
0-7803-8301-X
Type :
conf
DOI :
10.1109/ICT.2003.1287603
Filename :
1287603
Link To Document :
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