• DocumentCode
    2833309
  • Title

    Micromachined thermoelectric test device based on silicon/germanium superlattices: Simulation, preparation and characterization of thermoelectric behavior

  • Author

    Schumann, J. ; Kleint, C.A. ; Vinzelberg, H. ; Thomas, J. ; Hecker, M. ; Nurnus, Joachim ; Boettner, H. ; Lambrecht, A. ; Künzel, C. ; Voelklein, F.

  • Author_Institution
    Leibniz-Inst. for Solid State & Mater. Res., Dresden, Germany
  • fYear
    2003
  • fDate
    17-21 Aug. 2003
  • Firstpage
    677
  • Lastpage
    681
  • Abstract
    Strain-symmetrized superlattice structures based on epitaxially grown Si/Ge multilayers are expected to be promising systems for efficient thermoelectric micro-systems. The paper presents the development of a membrane-type sensor device consisting of Si/Ge superlattice and SixGe1-x-alloy legs allowing the study of the thermoelectric behavior at minimized influence of the supporting substrate components. By means of numerical simulation the optimum layout parameters were determined as well as the temperature distribution within the device including the sensitivity to be expected were estimated. Black body radiation measurements of the functional parameters on nearly freestanding thermopile arrays in the sensor regime are presented.
  • Keywords
    elemental semiconductors; germanium; micromachining; microsensors; semiconductor superlattices; silicon; thermal conductivity; thermoelectric devices; thermoelectricity; Si-Ge; Si-Ge superlattices; SixGe1-x; SixGe1-x-alloy legs; membrane-type sensor device; micromachined thermoelectric test device; numerical simulation; optimum layout parameters; strain-symmetrized superlattice structures; temperature distribution; thermoelectric behavior; Germanium; Nonhomogeneous media; Sensor arrays; Sensor phenomena and characterization; Silicon; Superlattices; Testing; Thermal sensors; Thermoelectric devices; Thermoelectricity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Thermoelectrics, 2003 Twenty-Second International Conference on - ICT
  • Print_ISBN
    0-7803-8301-X
  • Type

    conf

  • DOI
    10.1109/ICT.2003.1287603
  • Filename
    1287603