DocumentCode
2833715
Title
Finite Element Analysis of Wheel-Rail Thermal-Contact Coupling When the Wheel´s Sliding
Author
Qi Wanming ; Zhang Jun ; Sun Chuanxi ; Wang Shengwu
Author_Institution
Sch. of Traffic & Transp. Eng., Dalian Jiaotong Univ., Dalian, China
fYear
2009
fDate
19-20 Dec. 2009
Firstpage
1
Lastpage
4
Abstract
The heat damage of wheel tread and rail surface is one of the problems that need to be solved urgently. In this paper, finite element method was used to analyze the problem of three-dimensional wheel-rail thermal contact coupling. The contact patch´s size of the cone and the wear type locomotive wheel tread was researched. The thermal-contact coupling was analyzed for wheel-rail temperature and stress field under locked wheel sliding in certain speeds considering the interaction of temperature field and the stress field, the wheel-rail contact problem and the changes of the relevant material parameters with temperature. The results show that the area of contact patch with wear type tread is bigger and its shape is near circular, while the shape of contact patch with cone type tread is slender oval. The material properties, which change with the temperature, has a great impact on the temperature field and stress field. This cannot be ignored. The temperature field has a great impact on the stress field. The trend of temperature´s increase and stress´ increase is the same. Relative to the cone type tread, the heat damage of wheel and rail is smaller than wear type tread.
Keywords
automotive engineering; finite element analysis; locomotives; sliding friction; temperature control; finite element analysis; locked wheel sliding; locomotive wheel tread; stress field; temperature field; wheel-rail thermal contact coupling; Finite element methods; Friction; Rail transportation; Railway engineering; Sun; Surface cracks; Temperature dependence; Thermal loading; Thermal stresses; Wheels;
fLanguage
English
Publisher
ieee
Conference_Titel
Information Engineering and Computer Science, 2009. ICIECS 2009. International Conference on
Conference_Location
Wuhan
Print_ISBN
978-1-4244-4994-1
Type
conf
DOI
10.1109/ICIECS.2009.5364291
Filename
5364291
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