• DocumentCode
    2833715
  • Title

    Finite Element Analysis of Wheel-Rail Thermal-Contact Coupling When the Wheel´s Sliding

  • Author

    Qi Wanming ; Zhang Jun ; Sun Chuanxi ; Wang Shengwu

  • Author_Institution
    Sch. of Traffic & Transp. Eng., Dalian Jiaotong Univ., Dalian, China
  • fYear
    2009
  • fDate
    19-20 Dec. 2009
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    The heat damage of wheel tread and rail surface is one of the problems that need to be solved urgently. In this paper, finite element method was used to analyze the problem of three-dimensional wheel-rail thermal contact coupling. The contact patch´s size of the cone and the wear type locomotive wheel tread was researched. The thermal-contact coupling was analyzed for wheel-rail temperature and stress field under locked wheel sliding in certain speeds considering the interaction of temperature field and the stress field, the wheel-rail contact problem and the changes of the relevant material parameters with temperature. The results show that the area of contact patch with wear type tread is bigger and its shape is near circular, while the shape of contact patch with cone type tread is slender oval. The material properties, which change with the temperature, has a great impact on the temperature field and stress field. This cannot be ignored. The temperature field has a great impact on the stress field. The trend of temperature´s increase and stress´ increase is the same. Relative to the cone type tread, the heat damage of wheel and rail is smaller than wear type tread.
  • Keywords
    automotive engineering; finite element analysis; locomotives; sliding friction; temperature control; finite element analysis; locked wheel sliding; locomotive wheel tread; stress field; temperature field; wheel-rail thermal contact coupling; Finite element methods; Friction; Rail transportation; Railway engineering; Sun; Surface cracks; Temperature dependence; Thermal loading; Thermal stresses; Wheels;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information Engineering and Computer Science, 2009. ICIECS 2009. International Conference on
  • Conference_Location
    Wuhan
  • Print_ISBN
    978-1-4244-4994-1
  • Type

    conf

  • DOI
    10.1109/ICIECS.2009.5364291
  • Filename
    5364291