• DocumentCode
    2834475
  • Title

    Soldering techniques for the assembly of high power solid-state lasers

  • Author

    Dolkemeyer, J. ; Funck, M. ; Morasch, V. ; Schnitzler, C. ; Loosen, P.

  • Author_Institution
    Lehrstuhl fur Technol. Optischer Syst., RWTH Aachen Univ., Aachen, Germany
  • fYear
    2009
  • fDate
    14-19 June 2009
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    Soldering techniques are of increasing interest for the manufacturing of laser systems. High thermal conductance required for effective and long-term-stable cooling of laser components and a low sensibility to environmental influences like temperature changes and humidity are the main reasons to join components by soldering. Compared to conventional mounting techniques, soldering demands highly complex process control. Detailed knowledge about the influence of mechanical stress caused by thermal expansion mismatch is necessary to properly choose not only the process strategy but also the dimensions of the components. This paper reports on the development of soldering techniques for the surface-mounted assembly of laser components such as lenses, mirrors, laser-crystals and nonlinear crystals used for the assembly of a miniaturized marking laser system "MicroSlab".
  • Keywords
    humidity; soldering; solid lasers; surface mount technology; thermal expansion; long-term-stable cooling; mechanical stress; process control; soldering; solid-state lasers; surface-mounted assembly; thermal conductance; thermal expansion mismatch; Assembly systems; Cooling; Humidity; Laser transitions; Manufacturing; Process control; Soldering; Solid lasers; Temperature sensors; Thermal conductivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Lasers and Electro-Optics 2009 and the European Quantum Electronics Conference. CLEO Europe - EQEC 2009. European Conference on
  • Conference_Location
    Munich
  • Print_ISBN
    978-1-4244-4079-5
  • Electronic_ISBN
    978-1-4244-4080-1
  • Type

    conf

  • DOI
    10.1109/CLEOE-EQEC.2009.5194646
  • Filename
    5194646