DocumentCode
2834475
Title
Soldering techniques for the assembly of high power solid-state lasers
Author
Dolkemeyer, J. ; Funck, M. ; Morasch, V. ; Schnitzler, C. ; Loosen, P.
Author_Institution
Lehrstuhl fur Technol. Optischer Syst., RWTH Aachen Univ., Aachen, Germany
fYear
2009
fDate
14-19 June 2009
Firstpage
1
Lastpage
1
Abstract
Soldering techniques are of increasing interest for the manufacturing of laser systems. High thermal conductance required for effective and long-term-stable cooling of laser components and a low sensibility to environmental influences like temperature changes and humidity are the main reasons to join components by soldering. Compared to conventional mounting techniques, soldering demands highly complex process control. Detailed knowledge about the influence of mechanical stress caused by thermal expansion mismatch is necessary to properly choose not only the process strategy but also the dimensions of the components. This paper reports on the development of soldering techniques for the surface-mounted assembly of laser components such as lenses, mirrors, laser-crystals and nonlinear crystals used for the assembly of a miniaturized marking laser system "MicroSlab".
Keywords
humidity; soldering; solid lasers; surface mount technology; thermal expansion; long-term-stable cooling; mechanical stress; process control; soldering; solid-state lasers; surface-mounted assembly; thermal conductance; thermal expansion mismatch; Assembly systems; Cooling; Humidity; Laser transitions; Manufacturing; Process control; Soldering; Solid lasers; Temperature sensors; Thermal conductivity;
fLanguage
English
Publisher
ieee
Conference_Titel
Lasers and Electro-Optics 2009 and the European Quantum Electronics Conference. CLEO Europe - EQEC 2009. European Conference on
Conference_Location
Munich
Print_ISBN
978-1-4244-4079-5
Electronic_ISBN
978-1-4244-4080-1
Type
conf
DOI
10.1109/CLEOE-EQEC.2009.5194646
Filename
5194646
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