• DocumentCode
    2834669
  • Title

    Thermal analysis of the ball grid array packages

  • Author

    Petrosyants, K.O. ; Rjabov, N.I.

  • Author_Institution
    Moscow State Inst. of Electron. & Math., Tech. Univ., Moscow, Russia
  • fYear
    2011
  • fDate
    9-12 Sept. 2011
  • Firstpage
    275
  • Lastpage
    278
  • Abstract
    New quasi - 3D numerical model for thermal analysis of the BGA packages is presented. The general 3D heat transfer problem is correctly transformed to the set of 2D equations for temperature distributions in different layers of the package. The complexity and CPU time of the thermal analysis are many times reduced. The results of BGA package thermal modeling are presented.
  • Keywords
    ball grid arrays; heat transfer; temperature distribution; thermal analysis; thermal management (packaging); 2D equations; BGA package thermal modeling; ball grid array packages; general 3D heat transfer problem; quasi3D numerical model; temperature distributions; thermal analysis; Electronic packaging thermal management; Electronics packaging; Materials; Mathematical model; Temperature distribution; Thermal analysis; Three dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design & Test Symposium (EWDTS), 2011 9th East-West
  • Conference_Location
    Sevastopol
  • Print_ISBN
    978-1-4577-1957-8
  • Type

    conf

  • DOI
    10.1109/EWDTS.2011.6116604
  • Filename
    6116604
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=2834669