Title :
Thermal analysis of the ball grid array packages
Author :
Petrosyants, K.O. ; Rjabov, N.I.
Author_Institution :
Moscow State Inst. of Electron. & Math., Tech. Univ., Moscow, Russia
Abstract :
New quasi - 3D numerical model for thermal analysis of the BGA packages is presented. The general 3D heat transfer problem is correctly transformed to the set of 2D equations for temperature distributions in different layers of the package. The complexity and CPU time of the thermal analysis are many times reduced. The results of BGA package thermal modeling are presented.
Keywords :
ball grid arrays; heat transfer; temperature distribution; thermal analysis; thermal management (packaging); 2D equations; BGA package thermal modeling; ball grid array packages; general 3D heat transfer problem; quasi3D numerical model; temperature distributions; thermal analysis; Electronic packaging thermal management; Electronics packaging; Materials; Mathematical model; Temperature distribution; Thermal analysis; Three dimensional displays;
Conference_Titel :
Design & Test Symposium (EWDTS), 2011 9th East-West
Conference_Location :
Sevastopol
Print_ISBN :
978-1-4577-1957-8
DOI :
10.1109/EWDTS.2011.6116604
