DocumentCode
283481
Title
Advanced microwave integrated circuit technology
Author
Priestley, N.E.
Author_Institution
Marconi Electronic Devices Ltd., Lincoln, UK
fYear
1988
fDate
32426
Firstpage
42370
Lastpage
42374
Abstract
The widely used thin film technology employed in the manufacture of microstrip microwave integrated circuits has been further developed. Thin film processes are now used to integrate the passive components which are normally added to the circuit in discrete form. Capacitors, resistors and air-bridge interconnections are fabricated in thin film thereby making the assembly operation much simpler. This leads to better circuit uniformity, lower manufacturing costs, higher reliability and excellent repeatable circuit performance. An example of the application of this technology is discussed and its usefulness in the design and manufacture of microwave and millimetric integrated circuits is presented
Keywords
microwave integrated circuits; thin film circuits; air-bridge interconnections; assembly operation; capacitors; circuit uniformity; manufacturing costs; microstrip; microwave integrated circuit technology; millimetric integrated circuits; passive components; reliability; repeatable circuit performance; resistors; thin film technology;
fLanguage
English
Publisher
iet
Conference_Titel
Manufacturing and Integration Techniques for Microwave Circuits, IEE Colloquium on
Conference_Location
London
Type
conf
Filename
209490
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