DocumentCode
2835475
Title
System in Package. Diagnosis and embedded repair
Author
Hahanov, Vladimir ; Sushanov, Aleksey ; Stepanova, Yulia ; Gorobets, Alexander
Author_Institution
Comput. Eng. Fac., Kharkov Nat. Univ. of Radioelectron., Kharkov, Ukraine
fYear
2010
fDate
17-20 Sept. 2010
Firstpage
468
Lastpage
472
Abstract
Problems of System in Package (SiP), as new constructive generation, modules testing are considered. The method of digital system diagnosis based on the disjunctive normal form, which is represented by fault coverage matrix of test sequences are proposed. The method is focused on embedded service functionality, presented as F-IP modules. Methods for embedded functionality repair are adapted.
Keywords
circuit testing; embedded systems; fault diagnosis; matrix algebra; system-in-package; F-IP modules; SiP; digital system diagnosis method; embedded repair; embedded service functionality; fault coverage matrix; module testing; system in package; test sequences; Crystals; Digital systems; Field programmable gate arrays; Maintenance engineering; Software; System-on-a-chip; Testing;
fLanguage
English
Publisher
ieee
Conference_Titel
Design & Test Symposium (EWDTS), 2010 East-West
Conference_Location
St. Petersburg
Print_ISBN
978-1-4244-9555-9
Type
conf
DOI
10.1109/EWDTS.2010.5742115
Filename
5742115
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