Array backplate architecture for monolithic microwave integrated circuits

Array backplate technology concepts are being developed for extremely high-frequency (EHF) monolithic-phased arrays. These arrays are mechanically simpler and promise to be reliable and more affordable to manufacture than earlier design approaches. A concept for an array backplate architecture for monolithic microwave integrated circuit (MMIC) applications is discussed. This concept for EHF receive and transmit array backplates relies on proven RF distribution structures and features an advanced fabrication technique which dispenses with the necessity of providing individually fabricated RF feedthroughs and a network of wires for the DC and control signal distribution. The backplate is stress-free because the heatsink matches the ceramic. The GaAs MMICs and backplate should operate reliably in extreme environments. The entire backplate is less than 1 inch thick. A commercial style, cofired ceramic process can be used. The multilayers and the interconnects can be done in a batch process.<>