• DocumentCode
    2837562
  • Title

    A rule-based inspection system for printed circuit boards

  • Author

    Mital, Dinesh P. ; Teoh, Eam Khwang

  • Author_Institution
    Sch. of Electr. & Electron. Eng., Nanyang Technol. Inst., Singapore
  • fYear
    1989
  • fDate
    22-24 Nov 1989
  • Firstpage
    665
  • Lastpage
    668
  • Abstract
    Techniques are presented for defect detection in printed circuit boards (PCBs) by analyzing their two-dimensional gray level image. A software package has been developed to detect short circuit of tracks, bridging of two or more adjacent solder joints, the presence of all components and the quality of solder joints of the PCB. The recognition of these defects is achieved by comparing the image data with the predefined data which is obtained during the teaching phase. Lighting, image processing techniques, and the great variation in the possible appearances of the PCBs complicated the development of the algorithms. The software has been used for inspection of the inhouse-manufactured PCB as well as the commercial ones. From the experimental results obtained, it is shown that both the accuracy and reliability of the proposed inspection system are satisfactory
  • Keywords
    computerised picture processing; electronic engineering computing; inspection; knowledge based systems; printed circuit testing; PCBs; accuracy; adjacent solder joints; bridging; components presence; defect detection; defect recognition; image analysis; image data; image processing; lighting; predefined data; printed circuit boards; reliability; rule-based inspection system; short circuit detection; software package; solder joints bridging; solder joints quality; teaching phase; tracks; two-dimensional gray level image; Automatic testing; Education; Hardware; Image analysis; Image processing; Image recognition; Inspection; Printed circuits; Software packages; Soldering;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    TENCON '89. Fourth IEEE Region 10 International Conference
  • Conference_Location
    Bombay
  • Type

    conf

  • DOI
    10.1109/TENCON.1989.177026
  • Filename
    177026