• DocumentCode
    2839066
  • Title

    The Technological Linkage of Four-posited Semiconductor Companies with Alliance and Non-alliance Partner

  • Author

    Wang, Chun-Chieh ; Huang, Mu-Hsuan ; Chen, Dar-Zen

  • Author_Institution
    Dept. of Libr. & Inf. Sci., Nat. Taiwan Univ., Taipei, Taiwan
  • Volume
    3
  • fYear
    2011
  • fDate
    26-27 Nov. 2011
  • Firstpage
    483
  • Lastpage
    486
  • Abstract
    The purpose of this study is to measure the difference between alliance and non-alliance partner that semiconductor companies technologically connect with. The semiconductor companies in the years of 1997-2010 build higher rates of technological linkage and technological alliance relationships. Technological dependence and knowledge flow based on patent citation are used to analyze technological linkage with alliance/non-alliance partner in different positions of semiconductor company. Phase I of this study, the technological dependence of four company positions with alliance/non-alliance partner are measured to discover the significant difference among company positions. And the knowledge flow between those companies and alliance/non-alliance partners are measured in phase II. The result indicates that the technological linkage promise technological alliance only significant of Leader and Broker.
  • Keywords
    patents; semiconductor industry; four-posited semiconductor companies; knowledge flow; nonalliance partner; patent citation; technological alliance relationships; technological dependence; technological linkage; Companies; Couplings; Electronics industry; Patents; Semiconductor device measurement; Technological innovation; Knowledge Flow; Semiconductor Industry; Technological Alliance; Technological Linkage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information Management, Innovation Management and Industrial Engineering (ICIII), 2011 International Conference on
  • Conference_Location
    Shenzhen
  • Print_ISBN
    978-1-61284-450-3
  • Type

    conf

  • DOI
    10.1109/ICIII.2011.397
  • Filename
    6116911