Title :
2004 Proceedings. 9th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces (IEEE Cat. No.04TH8742)
Abstract :
The following topics are dealt with: interconnection materials; manufacturing and reliability; MEMS and thin films; passives; new technologies; advanced substrate technologies; flip chip and underfills.
Keywords :
electronics packaging; MEMS; advanced packaging materials; advanced substrate technologies; flip chip; interconnection materials; manufacturing; new technologies; passives; reliability; thin films; underfills;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2004. Proceedings. 9th International Symposium on
Conference_Location :
Atlanta, GA, USA
Print_ISBN :
0-7803-8436-9
DOI :
10.1109/ISAPM.2004.1287976
