DocumentCode
2839475
Title
Liquid cooled approaches for high density avionics
Author
LeVasseur, Robert
Author_Institution
General Electric Aerospace, Binghamton, NY, USA
fYear
1991
fDate
14-17 Oct 1991
Firstpage
147
Lastpage
152
Abstract
Next-generation aircraft will require avionics that provide greater system performance in a smaller volume. That requires highly developed thermal management techniques. To meet this need, a liquid-cooled approach has been developed to replace the conventional air-cooled approach for high-power applications. Liquid-cooled chassis and flow-through modules have been developed to limit junction temperatures to acceptable levels. Liquid cooling also permits emergency operation after loss of coolant for longer time intervals, which is desirable for flight-critical airborne applications. Activity to data has emphasized the development of chassis and modules that support the US Department of Defense´s (DoD) two-level maintenance initiative as governed by the joint Integrated Avionics Working Group (JIAWG)
Keywords
aircraft instrumentation; cooling; modules; DoD; chassis modules; flow-through modules; high density avionics; junction temperatures; liquid cooling; military systems; thermal management techniques; two-level maintenance initiative; Aerospace electronics; Aircraft; Connectors; Coolants; Electronic packaging thermal management; Electronics packaging; Surface-mount technology; Temperature; Thermal management; Thermal management of electronics;
fLanguage
English
Publisher
ieee
Conference_Titel
Digital Avionics Systems Conference, 1991. Proceedings., IEEE/AIAA 10th
Conference_Location
Los Angeles, CA
Type
conf
DOI
10.1109/DASC.1991.177157
Filename
177157
Link To Document