• DocumentCode
    2839475
  • Title

    Liquid cooled approaches for high density avionics

  • Author

    LeVasseur, Robert

  • Author_Institution
    General Electric Aerospace, Binghamton, NY, USA
  • fYear
    1991
  • fDate
    14-17 Oct 1991
  • Firstpage
    147
  • Lastpage
    152
  • Abstract
    Next-generation aircraft will require avionics that provide greater system performance in a smaller volume. That requires highly developed thermal management techniques. To meet this need, a liquid-cooled approach has been developed to replace the conventional air-cooled approach for high-power applications. Liquid-cooled chassis and flow-through modules have been developed to limit junction temperatures to acceptable levels. Liquid cooling also permits emergency operation after loss of coolant for longer time intervals, which is desirable for flight-critical airborne applications. Activity to data has emphasized the development of chassis and modules that support the US Department of Defense´s (DoD) two-level maintenance initiative as governed by the joint Integrated Avionics Working Group (JIAWG)
  • Keywords
    aircraft instrumentation; cooling; modules; DoD; chassis modules; flow-through modules; high density avionics; junction temperatures; liquid cooling; military systems; thermal management techniques; two-level maintenance initiative; Aerospace electronics; Aircraft; Connectors; Coolants; Electronic packaging thermal management; Electronics packaging; Surface-mount technology; Temperature; Thermal management; Thermal management of electronics;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Digital Avionics Systems Conference, 1991. Proceedings., IEEE/AIAA 10th
  • Conference_Location
    Los Angeles, CA
  • Type

    conf

  • DOI
    10.1109/DASC.1991.177157
  • Filename
    177157