• DocumentCode
    2839577
  • Title

    Evaluation of ESD characteristics for 65 nm SOI technology

  • Author

    Mitra, Subhasish ; Putnam, Cynthia ; Gauthier, R. ; Halbach, Ralph ; Seguin, Chris ; Salman, A.

  • Author_Institution
    IBM Microelectron. Semicond. R&D Center, USA
  • fYear
    2005
  • fDate
    3-6 Oct. 2005
  • Firstpage
    21
  • Lastpage
    23
  • Abstract
    With aggressive scaling and continuous drive for higher performance requirements, electrostatic discharge is becoming a major reliability challenge for advanced integrated circuits. Products must be designed with proper ESD protection circuits to provide adequate robustness and as the limits of the device capability are reached, factors like device reliability due to ESD sensitivity became more critical. In this paper, the ESD characteristics of I/O elements in 65nm SOI technology are thoroughly evaluated. With an appropriate design implementation using these discrete elements, industry standard ESD robustness can be achieved.
  • Keywords
    electrostatic discharge; failure analysis; nanotechnology; semiconductor device reliability; silicon-on-insulator; 65 nm; ESD protection circuits; ESD sensitivity; SOI technology; advanced integrated circuits; device reliability; electrostatic discharge characteristics; Electrostatic discharge; Insulation; Laboratories; MOSFETs; Mechanical factors; Microelectronics; Research and development; Silicon on insulator technology; Tin; Tunneling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference, 2005. Proceedings. 2005 IEEE International
  • ISSN
    1078-621X
  • Print_ISBN
    0-7803-9212-4
  • Type

    conf

  • DOI
    10.1109/SOI.2005.1563520
  • Filename
    1563520