DocumentCode
2839577
Title
Evaluation of ESD characteristics for 65 nm SOI technology
Author
Mitra, Subhasish ; Putnam, Cynthia ; Gauthier, R. ; Halbach, Ralph ; Seguin, Chris ; Salman, A.
Author_Institution
IBM Microelectron. Semicond. R&D Center, USA
fYear
2005
fDate
3-6 Oct. 2005
Firstpage
21
Lastpage
23
Abstract
With aggressive scaling and continuous drive for higher performance requirements, electrostatic discharge is becoming a major reliability challenge for advanced integrated circuits. Products must be designed with proper ESD protection circuits to provide adequate robustness and as the limits of the device capability are reached, factors like device reliability due to ESD sensitivity became more critical. In this paper, the ESD characteristics of I/O elements in 65nm SOI technology are thoroughly evaluated. With an appropriate design implementation using these discrete elements, industry standard ESD robustness can be achieved.
Keywords
electrostatic discharge; failure analysis; nanotechnology; semiconductor device reliability; silicon-on-insulator; 65 nm; ESD protection circuits; ESD sensitivity; SOI technology; advanced integrated circuits; device reliability; electrostatic discharge characteristics; Electrostatic discharge; Insulation; Laboratories; MOSFETs; Mechanical factors; Microelectronics; Research and development; Silicon on insulator technology; Tin; Tunneling;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference, 2005. Proceedings. 2005 IEEE International
ISSN
1078-621X
Print_ISBN
0-7803-9212-4
Type
conf
DOI
10.1109/SOI.2005.1563520
Filename
1563520
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