DocumentCode :
2839596
Title :
Transport and leakage in super-critical thickness strained silicon directly on insulator MOSFETs with strained Si thickness up to 135 nm
Author :
Åberg, I. ; Cheng, Z. ; Langdo, T.A. ; Lauer, I. ; Lochtefeld, A. ; Antoniadis, D.A. ; Hoyt, J.L.
Author_Institution :
MIT, Cambridge, MA, USA
fYear :
2005
fDate :
3-6 Oct. 2005
Firstpage :
24
Lastpage :
26
Abstract :
In this work, we study both FD- and PD-SSOI with aggressive TSi of up to 135 nm for 14% SSOI (14% Ge equivalent strain). We have demonstrated that mobility in 14% SSOI is independent of the strained Si thickness, even for as grown films 10× thicker than the critical thickness. Off-state current also remains independent of TSi. The successful fabrication of PD-SSOI with electron mobility enhancement maintained at 1.5×, for high channel doping and strained Si thickness up to 135 nm, was also demonstrated, showing promise for thicker film PD-SOI applications.
Keywords :
MOSFET; electron mobility; elemental semiconductors; semiconductor doping; semiconductor thin films; silicon; silicon-on-insulator; MOSFET; Si; channel doping; electron mobility enhancement; off-state current; strained Si thickness; strained silicon directly on insulator; super-critical thickness; Capacitive sensors; Electron mobility; Fabrication; Germanium silicon alloys; Insulation; MOSFET circuits; Semiconductor films; Silicon germanium; Silicon on insulator technology; Substrates;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 2005. Proceedings. 2005 IEEE International
ISSN :
1078-621X
Print_ISBN :
0-7803-9212-4
Type :
conf
DOI :
10.1109/SOI.2005.1563521
Filename :
1563521
Link To Document :
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