Title :
An experimental study of the relaxation behaviour of strained Ga 1-xInxP layers grown on GaAs
Author :
Schuler, O. ; Wallart, X. ; Mollot, F.
Author_Institution :
Inst. d´´Electron. et de Microelectron. du Nord, Villeneuve d´´Ascq, France
Abstract :
The growth of strained Ga1-xInxP alloys on GaAs substrate with the indium composition varying from 0 (GaP) to 1 (InP) was studied by means of reflection high energy electron diffraction (RHEED). Compressive layers (x>0.48) exhibit an InGaAs-like behaviour. Below 2% misfit strain (x⩽0.75) plastic relaxation occurs before the 2D-3D growth mode transition for which the lattice parameter relaxation is observed directly on the RHEED pattern. However, growth temperature has not a strong influence on the relaxation behaviour as in the InGaAs/InP system. On the other hand, if layers under tensile strain have a normal behaviour at low temperature, the critical thickness is found to be independent of the composition for x<0.35 at higher temperature (520°C). This unusual behaviour, as compared to strained InGaAs on InP layers for instance, could be associated to a spinodal decomposition of the GaInP alloy
Keywords :
III-V semiconductors; anelastic relaxation; chemical beam epitaxial growth; gallium compounds; indium compounds; internal stresses; lattice constants; reflection high energy electron diffraction; semiconductor epitaxial layers; semiconductor growth; spinodal decomposition; stress relaxation; 2D-3D growth mode transition; GSMBE; Ga1-xInxP; GaAs; GaAs substrate; GaInP; GaInP-GaAs; GaP; InP; RHEED; composition dependence; compressive layers; critical thickness; growth temperature; lattice parameter relaxation; misfit strain; plastic relaxation; reflection high energy electron diffraction; relaxation behaviour; spinodal decomposition; strained layers; tensile layers; Capacitive sensors; Diffraction; Electrons; Gallium alloys; Gallium arsenide; Indium gallium arsenide; Indium phosphide; Plastics; Reflection; Temperature;
Conference_Titel :
Indium Phosphide and Related Materials, 1998 International Conference on
Conference_Location :
Tsukuba
Print_ISBN :
0-7803-4220-8
DOI :
10.1109/ICIPRM.1998.712698