• DocumentCode
    2839745
  • Title

    Electrical property of conductive adhesives during temperature/humidity aging

  • Author

    Moon, Kyoung-Sik ; Li, Yi ; Wong, C.P.

  • Author_Institution
    Sch. of Mater. Sci. & Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2004
  • fDate
    2004
  • Firstpage
    126
  • Lastpage
    131
  • Abstract
    Effects of carbon black, carbon fiber and silver coated glass fiber on the bulk resistivity of the isotropically conductive adhesives (ICAs) and their contact resistance on Cu and Sn surfaces during the 85 °C/85% RH were investigated. The ICA formulations incorporated with the small amount of the carbon fiber and the silvered fiber showed slightly lower bulk resistivity values than the control formulation, while the ICA formulation with the carbon black showed a significant increase (an order of magnitude) in resistivity. The ICA formulations incorporated with the silvered fiber by 3% and 5% showed relatively stable contact resistance on Sri during aging, although these formulations showed a gradual increase over 20% in contact resistance.
  • Keywords
    adhesives; ageing; carbon fibre reinforced plastics; conducting polymers; contact resistance; curing; electrical resistivity; electronics packaging; environmental degradation; filled polymers; glass fibre reinforced plastics; bis-F type epoxy; bulk resistivity; carbon black; carbon fiber; contact resistance; humidity aging; isotropically conductive adhesives; silver coated glass fiber; temperature aging; Aging; Conductive adhesives; Conductivity; Contact resistance; Glass; Humidity; Independent component analysis; Silver; Temperature; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Packaging Materials: Processes, Properties and Interfaces, 2004. Proceedings. 9th International Symposium on
  • Print_ISBN
    0-7803-8436-9
  • Type

    conf

  • DOI
    10.1109/ISAPM.2004.1288002
  • Filename
    1288002