DocumentCode :
2840012
Title :
The formation of sub-micro partial SOI materials by SIMOX technology
Author :
Sun, Jiayin ; Chen, Jing ; Chen, Meng ; Wang, Xi
Author_Institution :
Chinese Acad. of Sci., Shanghai Inst. of Microsyst. & Inf. Technol., China
fYear :
2005
fDate :
3-6 Oct. 2005
Firstpage :
92
Lastpage :
93
Abstract :
In this paper, we try to fabricate sub-micro windows in BOX layer. The pattern thermal oxide layer we used for mask implantation was shown. The typical widths of thermal oxide strips are 150nm and ∼75nm and the space of each strips is 1μm. The O+ ions are implanted through the patterned masking oxide. The XTEM images of the SOI structures are shown. The widths of BOX windows are 236nm (left) and 150 nm (right). It is very interesting that the windows are about 75 nm wider than the corresponding masking strips.
Keywords :
SIMOX; buried layers; ion implantation; masks; semiconductor doping; transmission electron microscopes; 1 micron; 236 nm; BOX layer; SIMOX technology; SOI structures; XTEM images; buried oxide layer; mask implantation; masking oxide; masking strips; partial SOI materials; silicon-on-insulator; sub-micro windows; thermal oxide layer; thermal oxide strips; Annealing; Information technology; Insulation; Lithography; Materials science and technology; Power integrated circuits; Silicon on insulator technology; Strips; Sun; Thermal conductivity;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
SOI Conference, 2005. Proceedings. 2005 IEEE International
ISSN :
1078-621X
Print_ISBN :
0-7803-9212-4
Type :
conf
DOI :
10.1109/SOI.2005.1563547
Filename :
1563547
Link To Document :
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