DocumentCode
2840107
Title
Predicting the strength of underfill/polyimide interfaces
Author
Pearson, Raymond A. ; Oldak, Robert
Author_Institution
Dept. of Mater. Sci. & Eng., Lehigh Univ., Bethlehem, PA, USA
fYear
2004
fDate
2004
Firstpage
264
Lastpage
266
Abstract
Epoxy/polyimide interfaces are often found in microelectronics. Underfill/polyimide interfaces are found in many flip-chip packages. The strength of such interfaces is of paramount importance to reliability. As our understanding of interfacial phenomena grows, so does our ability to produce strong interfaces. This paper examines the underlying factors controlling the strength of underfill-polyimide interfaces.
Keywords
adhesion; adhesive bonding; curing; electronics packaging; encapsulation; flip-chip devices; interface phenomena; Drago constants; adhesion; adhesive strength; curing agents; epoxy/polyimide interfaces; flip-chip packages; interface reliability; interfacial phenomena; microelectronics packaging; underfill/polyimide interface strength; Adhesive strength; Chemicals; Energy measurement; Goniometers; Materials science and technology; Microelectronics; Packaging; Polyimides; Polymers; Reliability engineering;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Packaging Materials: Processes, Properties and Interfaces, 2004. Proceedings. 9th International Symposium on
Print_ISBN
0-7803-8436-9
Type
conf
DOI
10.1109/ISAPM.2004.1288024
Filename
1288024
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