Title :
Predicting the strength of underfill/polyimide interfaces
Author :
Pearson, Raymond A. ; Oldak, Robert
Author_Institution :
Dept. of Mater. Sci. & Eng., Lehigh Univ., Bethlehem, PA, USA
Abstract :
Epoxy/polyimide interfaces are often found in microelectronics. Underfill/polyimide interfaces are found in many flip-chip packages. The strength of such interfaces is of paramount importance to reliability. As our understanding of interfacial phenomena grows, so does our ability to produce strong interfaces. This paper examines the underlying factors controlling the strength of underfill-polyimide interfaces.
Keywords :
adhesion; adhesive bonding; curing; electronics packaging; encapsulation; flip-chip devices; interface phenomena; Drago constants; adhesion; adhesive strength; curing agents; epoxy/polyimide interfaces; flip-chip packages; interface reliability; interfacial phenomena; microelectronics packaging; underfill/polyimide interface strength; Adhesive strength; Chemicals; Energy measurement; Goniometers; Materials science and technology; Microelectronics; Packaging; Polyimides; Polymers; Reliability engineering;
Conference_Titel :
Advanced Packaging Materials: Processes, Properties and Interfaces, 2004. Proceedings. 9th International Symposium on
Print_ISBN :
0-7803-8436-9
DOI :
10.1109/ISAPM.2004.1288024
