Layer-transfer process modifications for fabricating hybrid crystal orientation engineered substrates

Successful integration of hybrid-orientation substrates into high-volume production requires a layer-transfer process to prepare the substrates. Modifications of SiGen´s NanoCleave™ layer-transfer process were tested for compatibility to cleave and smooth [110] films, produce multi-stack composites and prepare direct bonded film structures. The technology has the promise to be a viable manufacturing process for strained and unstrained hybrid-orientation substrates used for deep submicron mobility enhancement.