Ultra-thin strained Si on insulator substrate using laser annealing

We describe a low-temperature process for fabricating strained silicon on insulator (SOI) substrates using excimer laser annealing technology. We used an excimer laser to relax the SiGe layer on the SOI substrate. We can fabricate ultra-thin strained SOI by removing the relaxed SiGe layer on the SOI after laser annealing. Strains are investigated using ultraviolet (UV)-Raman spectroscopy and transmission electron microscopy (TEM).