DocumentCode
2840594
Title
Plastic packaging of optical modules for the access network system applications
Author
Tatsuno, Kyoichi
Author_Institution
Hitachi Ltd., Tokyo, Japan
fYear
1998
fDate
22-27 Feb. 1998
Firstpage
346
Lastpage
347
Abstract
Summary form only given. Cost reduction and mass production of optical modules are essential requirements for the realization of optical subscriber access network systems keeping high-speed bi-directional digital fiber communication performance, which are expected by the coming multimedia generation. In this paper, plastic optical modules applying technologies, which have been developed in the field of LSIs are proposed. They are passive surface mountings on Si sub-mounts for bare components and plastic packagings. These technologies lead low-cost solution and mass production for the optical communication modules with high performance and high reliability.
Keywords
integrated optoelectronics; modules; optical fibre subscriber loops; optical receivers; optical transmitters; plastic packaging; MiniDIL receivers; MiniDIL transmitter; cost reduction; high performance; high reliability; mass production; optical modules; optical subscriber access network systems; passive surface mountings; plastic packaging; silicon sub-mounts; Erbium; Fiber nonlinear optics; High speed optical techniques; Length measurement; Nonlinear optics; Optical fiber networks; Optical fibers; Optical sensors; Plastic packaging; Wavelength measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Optical Fiber Communication Conference and Exhibit, 1998. OFC '98., Technical Digest
Conference_Location
San Jose, CA, USA
Print_ISBN
1-55752-521-8
Type
conf
DOI
10.1109/OFC.1998.657460
Filename
657460
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