• DocumentCode
    2840594
  • Title

    Plastic packaging of optical modules for the access network system applications

  • Author

    Tatsuno, Kyoichi

  • Author_Institution
    Hitachi Ltd., Tokyo, Japan
  • fYear
    1998
  • fDate
    22-27 Feb. 1998
  • Firstpage
    346
  • Lastpage
    347
  • Abstract
    Summary form only given. Cost reduction and mass production of optical modules are essential requirements for the realization of optical subscriber access network systems keeping high-speed bi-directional digital fiber communication performance, which are expected by the coming multimedia generation. In this paper, plastic optical modules applying technologies, which have been developed in the field of LSIs are proposed. They are passive surface mountings on Si sub-mounts for bare components and plastic packagings. These technologies lead low-cost solution and mass production for the optical communication modules with high performance and high reliability.
  • Keywords
    integrated optoelectronics; modules; optical fibre subscriber loops; optical receivers; optical transmitters; plastic packaging; MiniDIL receivers; MiniDIL transmitter; cost reduction; high performance; high reliability; mass production; optical modules; optical subscriber access network systems; passive surface mountings; plastic packaging; silicon sub-mounts; Erbium; Fiber nonlinear optics; High speed optical techniques; Length measurement; Nonlinear optics; Optical fiber networks; Optical fibers; Optical sensors; Plastic packaging; Wavelength measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical Fiber Communication Conference and Exhibit, 1998. OFC '98., Technical Digest
  • Conference_Location
    San Jose, CA, USA
  • Print_ISBN
    1-55752-521-8
  • Type

    conf

  • DOI
    10.1109/OFC.1998.657460
  • Filename
    657460