Title :
Plastic encapsulated 1.3-/spl mu/m laser on Si substrate for long-haul transmission
Author :
Artigue, C. ; Rabaron, S. ; Toullier, D. ; Lestra, A. ; Tregoat, D. ; Lafragette, J.-L. ; Grard, E. ; Fernier, B. ; Jorg, W. ; Scherb, J. ; Seibold, G. ; Goth, A.
Author_Institution :
Alcatel Alsthom Recherche, Marcoussis, France
Abstract :
Summary form only given. This paper reports 1.3-/spl mu/m laser passively aligned with a cleaved single-mode fiber and encapsulated with silicone rubber on a Si substrate. Under 70-mA DC operation at 85/spl deg/C, a fiber power >2 mW is obtained for several assemblies. This result is thought to be the highest value reported so far for such type of device. It shows that these advanced technologies are promising for long-haul transmission.
Keywords :
encapsulation; flip-chip devices; integrated optoelectronics; modules; optical fibre couplers; optical transmitters; plastic packaging; quantum well lasers; 1.3 micron; MQW laser; Si substrate; V-groove; cleaved single-mode fiber; encapsulated with silicone rubber; flip chip; high power uncooled operation; long-haul transmission; passively aligned; plastic encapsulated laser; Assembly; Electron optics; Encapsulation; Fiber lasers; Laser modes; Optical fiber communication; Optical fibers; Plastics; Quantum well lasers; Rubber;
Conference_Titel :
Optical Fiber Communication Conference and Exhibit, 1998. OFC '98., Technical Digest
Conference_Location :
San Jose, CA, USA
Print_ISBN :
1-55752-521-8
DOI :
10.1109/OFC.1998.657462
