Plastic encapsulated 1.3-/spl mu/m laser on Si substrate for long-haul transmission

Author

Artigue, C. ; Rabaron, S. ; Toullier, D. ; Lestra, A. ; Tregoat, D. ; Lafragette, J.-L. ; Grard, E. ; Fernier, B. ; Jorg, W. ; Scherb, J. ; Seibold, G. ; Goth, A.

Author_Institution

Alcatel Alsthom Recherche, Marcoussis, France

fYear

1998

fDate

22-27 Feb. 1998

Firstpage

348

Lastpage

349

Abstract

Summary form only given. This paper reports 1.3-/spl mu/m laser passively aligned with a cleaved single-mode fiber and encapsulated with silicone rubber on a Si substrate. Under 70-mA DC operation at 85/spl deg/C, a fiber power >2 mW is obtained for several assemblies. This result is thought to be the highest value reported so far for such type of device. It shows that these advanced technologies are promising for long-haul transmission.

Keywords

encapsulation; flip-chip devices; integrated optoelectronics; modules; optical fibre couplers; optical transmitters; plastic packaging; quantum well lasers; 1.3 micron; MQW laser; Si substrate; V-groove; cleaved single-mode fiber; encapsulated with silicone rubber; flip chip; high power uncooled operation; long-haul transmission; passively aligned; plastic encapsulated laser; Assembly; Electron optics; Encapsulation; Fiber lasers; Laser modes; Optical fiber communication; Optical fibers; Plastics; Quantum well lasers; Rubber;

fLanguage

English

Publisher

ieee

Conference_Titel

Optical Fiber Communication Conference and Exhibit, 1998. OFC '98., Technical Digest

Conference_Location

San Jose, CA, USA

Print_ISBN

1-55752-521-8

Type

conf

DOI

10.1109/OFC.1998.657462

Filename

657462