Analysis of cooling a microprocessor using embedded thermoelectric coolers

Recently, advanced embedded thermoelectric coolers (eTECs) have been demonstrated for mitigating thermal problems. Operating IC at a lower temperature can result in reduced electronic power, improved reliability and potentially improved speed. However, total power dissipation must include both the electronic power and the cooling power. This study explores the amount of total power reduction using eTECs. We present a model that incorporates both a real-world microprocessor and thermoelectric cooling systems. The analysis indicates that an optimal operating point exists and depends on the parameters of electronics and cooling systems. Using the thermoelectric element of ZT=1, we demonstrate that power savings of at least 15% is realizable when the electronic components have leakage power ratio that are greater than 50%. The analysis also shows that the amount of power saving is projected to improve with technology due to increased leakage, reaching up to 16% for 32nm technology and beyond.