Title :
Vacuum underfill technology for advanced packaging (IMPACT 2011)
Author :
Hoshiyama, M. ; Hasegawa, M. ; Sato, T. ; Yoshii, H. ; Suzuki, O. ; Kotaka, K. ; Nagasaka, T. ; Horibe, A. ; Paquet, M.-C. ; Gaynes, M. ; Feger, C. ; Sakuma, K. ; Knickerbocker, J.U. ; Orii, Y. ; Terada, K. ; Ishikawa, K. ; Hirayama, Y.
Author_Institution :
Namics Corp., Niigata, Japan
Abstract :
We developed vacuum underfill (VCUF) technology for large die (>;18 × 18 mm) with fine pitch area array bumps (<; 150 μm pitch) to solve a critical underfill void issue. Material development and process optimization are the keys to realize a stable process for future package. It was also confirmed that the newly developed underfill materials have good reliability on the large die package with vacuum assisted underfill process.
Keywords :
electronics packaging; fine-pitch technology; integrated circuit reliability; optimisation; advanced packaging; critical underfill void; fine pitch area array bumps; large die package; process optimization; reliability; vacuum underfill technology; Delamination; Materials reliability; Three dimensional displays; Vacuum technology; Viscosity;
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International
Conference_Location :
Taipei
Print_ISBN :
978-1-4577-1387-3
Electronic_ISBN :
2150-5934
DOI :
10.1109/IMPACT.2011.6117165
