DocumentCode :
2841564
Title :
Semiconductor packages for automotive applications
Author :
Nakajima, Hirofumi
Author_Institution :
Renesas Electron. Corp., Kawasaki, Japan
fYear :
2011
fDate :
19-21 Oct. 2011
Firstpage :
287
Lastpage :
290
Abstract :
Automotive Electronics Revolutions in automotive technology have been driven by two motivations; maximizing comfort and fun, and “zeronizing” accidents and eco-hazards.[1] Recent resource-conservation move has promoted applications of electronic technology for better gas utilization. Many mechanical parts have been replaced by semiconductor devices, microelectromechanical systems (MEMS) and electric motors to make vehicles safer, more comfortable and eco-friendly. Numbers of electronic control units (ECUs), MEMS and electric motors used in a vehicle have reached 100 to 130 pieces now. Downward trend of MEMS costs has also boosted the adoption of MEMS for vehicles. These replacement of mechanical parts with electronic devices are taking place in all parts in a vehicle, such as power train including an engine, transmission and battery controls; networking including controller area network and local interconnect network; information and entertainment system including global positioning system-based navigation and mobile communication; body and security system including a cipher door lock, power window, air conditioning and intelligent beam; and safety system including predictive and proactive mechanisms, avalanche airbag safety system, stability controls and driver´s face monitoring. Consequently, number of electrical and electronic devices used in a vehicle has been increasing, boosting the ratio in material cost. Small vehicles generally spend 15% of material costs on electrical and electronic devices and consume 0.21 wafer with a diameter of 150 mm. Luxury vehicles spend 28% and consume 0.48 wafer, and hybrid electric vehicles (HEV) spend 47% and consume as much as 0.96 wafer. Regulations against CO2 emission are accelerating the move to electric vehicles and raising the consumption of silicon. The amount of silicon consumed for a vehicle is significant when compared with a typical personal computer, where 0.12 wafer is consumed.[2]
Keywords :
automotive electronics; carbon compounds; controller area networks; electronics packaging; hybrid electric vehicles; safety systems; CO2; CO2 emission; air conditioning; automotive electronics; avalanche airbag safety system; cipher door lock; controller area network; driver face monitoring; electric motors; electronic control units; gas utilization; global positioning system-based navigation; hybrid electric vehicles; intelligent beam; local interconnect network; material cost; microelectromechanical systems; mobile communication; power train; power window; resource-conservation move; semiconductor packages; size 150 nm; stability controls; Batteries; Copper; Engines; Materials; Resistance; Vehicles; Wires;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT), 2011 6th International
Conference_Location :
Taipei
ISSN :
2150-5934
Print_ISBN :
978-1-4577-1387-3
Electronic_ISBN :
2150-5934
Type :
conf
DOI :
10.1109/IMPACT.2011.6117172
Filename :
6117172
Link To Document :
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