Title :
Signal integrity and robustness of ACCI packaged systems
Author :
Luo, Lei ; Wilson, John ; Xu, Jian ; Mick, Stephen ; Franzon, Paul
Author_Institution :
Dept. of Electr. & Comput. Eng., North Carolina State Univ., Raleigh, NC, USA
Abstract :
AC coupled interconnects (ACCI) enable reliable multiGiga-b/s/channel communication with less than 100μm pin pitch, and with BER less than 10-12. This paper discusses the potential for switching noise, crosstalk and ISI control in ACCI system.
Keywords :
crosstalk; integrated circuit interconnections; integrated circuit noise; integrated circuit packaging; AC coupled interconnects; ACCI packaged systems; ISI control; crosstalk; signal integrity; switching noise; Circuit noise; Communication switching; Crosstalk; Integrated circuit interconnections; Noise level; Noise reduction; Packaging; Power supplies; Robustness; Voltage;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN :
0-7803-9220-5
DOI :
10.1109/EPEP.2005.1563687
