A study in new fin pattern of stacked fin sink for heat convection enhancement

This study is devoted to develop a high performance heat sink for electrical product cooling. With CPU/IC power increase, the traditional stacked fink heat sink is hard to meet the new generation CPU/IC cooling requirement in the same space. Here a high performance sink is developed to solve this problem. A multi small streamline surface pattern is conducted into stacked fin sink for performance enhancement. Through CFD analysis, it is understood the local flow & thermal field behavior in fin region and understood how it effect in heat exchange. According to Bernoulli´s Law, the air flow through the streamline surface will generate a pressure difference between top surface and bottom surface so that the air can be sucked/blew into another channel. The thermal boundary layer is destroyed when the airflow is sucked to another channel and achieves the purpose of heat exchange enhancement. The phenomenon is like a flat plate with wall blowing/suction flow which can enhance heat convection and it is approved in heat transfer textbooks. It makes the component cooling more efficiently. The result indicates 7~10% improvement in CPU temperature can be got by adding multi small streamline in the stacked fin.