DocumentCode
2842234
Title
Extraction of frequency dependent RLCG parameters of the packaging interconnects on low-loss substrates from frequency domain measurements
Author
Chen, Guang ; Zhu, Lin ; Melde, Kathleen L.
Author_Institution
Dept. of Electr. & Comput. Eng., Arizona Univ., Tucson, AZ, USA
fYear
2005
fDate
24-26 Oct. 2005
Firstpage
25
Lastpage
28
Abstract
A new approach to extract the frequency dependent RLGC parameters of transmission lines on low-loss substrates is proposed. The approach is based on a comparison of the frequency domain measurements on a transmission line using two different calibration techniques.
Keywords
frequency-domain analysis; integrated circuit interconnections; integrated circuit measurement; integrated circuit packaging; calibration techniques; frequency dependent RLCG parameters; frequency domain measurements; low-loss substrates; packaging interconnects; transmission lines; Calibration; Coplanar waveguides; Electronics packaging; Frequency dependence; Frequency domain analysis; Frequency measurement; Impedance; Transmission line matrix methods; Transmission line measurements; Transmission lines;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN
0-7803-9220-5
Type
conf
DOI
10.1109/EPEP.2005.1563691
Filename
1563691
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