DocumentCode
2842292
Title
Losses caused by roughness of metallization in printed-circuit boards
Author
Deutsch, A. ; Surovic, C. ; Krabbenhoft, R. ; Kopcsay, G.V. ; Chamberlin, B.
Author_Institution
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
fYear
2005
fDate
24-26 Oct. 2005
Firstpage
39
Lastpage
42
Abstract
In this paper the effect of metal roughness on the total loss, the extracted tan δ, and signal integrity of typical interconnections found in printed-circuit boards is extracted from measurements on three different materials. The differing characteristics of the roughened metal cross sections are highlighted, and a simplified, practical, two-dimensional, causal, broadband modeling methodology is shown.
Keywords
integrated circuit metallisation; printed circuits; broadband modeling methodology; causal modeling methodology; interconnections; metal roughness; printed circuit board metallization; signal integrity; Dielectric constant; Dielectric losses; Dielectric materials; Erbium; Frequency; Inorganic materials; Integrated circuit interconnections; Metallization; Predictive models; System performance;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN
0-7803-9220-5
Type
conf
DOI
10.1109/EPEP.2005.1563695
Filename
1563695
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