Title :
Losses caused by roughness of metallization in printed-circuit boards
Author :
Deutsch, A. ; Surovic, C. ; Krabbenhoft, R. ; Kopcsay, G.V. ; Chamberlin, B.
Author_Institution :
IBM T. J. Watson Res. Center, Yorktown Heights, NY, USA
Abstract :
In this paper the effect of metal roughness on the total loss, the extracted tan δ, and signal integrity of typical interconnections found in printed-circuit boards is extracted from measurements on three different materials. The differing characteristics of the roughened metal cross sections are highlighted, and a simplified, practical, two-dimensional, causal, broadband modeling methodology is shown.
Keywords :
integrated circuit metallisation; printed circuits; broadband modeling methodology; causal modeling methodology; interconnections; metal roughness; printed circuit board metallization; signal integrity; Dielectric constant; Dielectric losses; Dielectric materials; Erbium; Frequency; Inorganic materials; Integrated circuit interconnections; Metallization; Predictive models; System performance;
Conference_Titel :
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN :
0-7803-9220-5
DOI :
10.1109/EPEP.2005.1563695
