Discontinuity impacts and design considerations of high speed differential signals in FC-PBGA packages with high wiring density

Author

Na, Nanju ; Audet, Jean ; Zwitter, Deborah

Author_Institution

IBM Syst. & Technol. Group, Essex Junction, VT, USA

fYear

2005

fDate

24-26 Oct. 2005

Firstpage

107

Lastpage

110

Abstract

Various discontinuities along the package signal path cause reflections and serious performance impact on high speed signals. This paper discusses performance impacts of BGA and PTH via structures as major discontinuities in FCPBGA packages on high speed SerDes (HSS) signals operating in differential mode using S-parameters and TDR waveforms from simulations and measurements of HSS signals on an FC-PBGA package of 4 to 6Gbps application. It also discusses design suggestions to ensure sufficient performance in both isolation between neighboring HSS signals in concern of high coupling noise and reflection minimization at individual differential pairs for optimal performance in packages with high wiring density.

Keywords

S-parameters; ball grid arrays; integrated circuit design; integrated circuit packaging; 4 to 6 Gbit/s; BGA via structure; FCPBGA package discontinuity; PTH via structure; S-parameters; TDR waveforms; differential mode; high speed SerDes signals; high speed differential signals; package signal path; wiring density; Couplings; Delay; Performance loss; Plastic packaging; Power supplies; Propagation losses; Reflection; Signal design; Testing; Wiring;

fLanguage

English

Publisher

ieee

Conference_Titel

Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on

Print_ISBN

0-7803-9220-5

Type

conf

DOI

10.1109/EPEP.2005.1563713

Filename

1563713