DocumentCode
2842724
Title
Towards a traveling wave power distribution module using micromachined packaging techniques for millimeter and submillimeter wave applications
Author
Dickman, E.J. ; Becker, James P.
Author_Institution
Dept. of Electr. & Comput. Eng., Montana State Univ., Bozeman, MT, USA
fYear
2005
fDate
24-26 Oct. 2005
Firstpage
139
Lastpage
142
Abstract
The design of a waveguide-based power distribution module is presented. Traveling-wave in nature and readily realizable using existing micromachining processes, the structure is a promising candidate for millimeter and submillimeter wave applications.
Keywords
integrated circuit packaging; micromachining; millimetre wave circuits; power combiners; submillimetre wave circuits; micromachined packaging techniques; millimeter wave applications; submillimeter wave applications; traveling wave power distribution module; Application software; Frequency; Micromachining; Packaging; Planar waveguides; Power distribution; Probes; Solid state circuits; Submillimeter wave propagation; Submillimeter wave technology;
fLanguage
English
Publisher
ieee
Conference_Titel
Electrical Performance of Electronic Packaging, 2005. IEEE 14th Topical Meeting on
Print_ISBN
0-7803-9220-5
Type
conf
DOI
10.1109/EPEP.2005.1563721
Filename
1563721
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