Analysis and issues of developing a build-up laminate multi-chip-module

In order to study and provide valuable insight into the technical issues involved with the design of a specific packaging technology, a build-up laminate MCM was developed and built as a test vehicle. The following case study examines the ensuing electrical, thermal, and mechanical analysis, as well as a detailed wiring feasibility study. The design, analysis and verification techniques used are discussed and compared against existing data for single-chip modules of the same technology.